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Connectors, Interconnects

Sockets for ICs, Transistors

Datasheet Image M-Part Number Manufacturer Description Quantity Est. Market Price Min. Quantity Packaging Series Part Status Type Numberof Positionsor Pins Grid Pitch Mating Contact Finish Mating Contact Finish Thickness Mating Contact Material Mating Mounting Type Features Termination Pitch Post Contact Finish Post Contact Finish Thickness Post Contact Material Post Dielectric Material Operating Temperature
Product Image A-CCS 032-Z-SM Assmann WSW Components

IC PLCC SOCKET 32POS TIN SMD

1 Minimum: 1 Tube - Active PLCC 32 (4 x 8) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Polyamide (PA9T), Nylon 9T, Glass Filled -40°C ~ 105°C
Product Image AR 16 HZL-TT Assmann WSW Components

CONN IC DIP SOCKET 16POS TIN

1 Minimum: 1 Tube - Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
Product Image A-CCS-044-Z-T Assmann WSW Components

CONN SOCKET PLCC 44POS TIN

1 Minimum: 1 Tube - Active PLCC 44 (4 x 11) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 160.0µin (4.06µm) Phosphor Bronze Polybutylene Terephthalate (PBT) -40°C ~ 105°C
Product Image 1050281001 Molex

CONN CAM SOCKET 32POS GOLD

800 Minimum: 800 Tape & Reel (TR) Alternate Packaging 105028 Active Camera Socket 32 (4 x 8) 0.035" (0.90mm) Gold 12.0µin (0.30µm) Copper Alloy Surface Mount Open Frame Solder 0.035" (0.90mm) Nickel 50.0µin (1.27µm) Copper Alloy Thermoplastic -
Product Image 1050281001 Molex

CONN CAM SOCKET 32POS GOLD

1 Minimum: 1 Cut Tape (CT) Alternate Packaging 105028 Active Camera Socket 32 (4 x 8) 0.035" (0.90mm) Gold 12.0µin (0.30µm) Copper Alloy Surface Mount Open Frame Solder 0.035" (0.90mm) Nickel 50.0µin (1.27µm) Copper Alloy Thermoplastic -
Product Image 1050281001 Molex

CONN CAM SOCKET 32POS GOLD

- 1 Minimum: 1 Reel Alternate Packaging 105028 Active Camera Socket 32 (4 x 8) 0.035" (0.90mm) Gold 12.0µin (0.30µm) Copper Alloy Surface Mount Open Frame Solder 0.035" (0.90mm) Nickel 50.0µin (1.27µm) Copper Alloy Thermoplastic -
Product Image 110-44-424-41-001000 Mill-Max Manufacturing Corp.

CONN IC DIP SOCKET 24POS TIN

1 Minimum: 1 Tube 110 Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
Product Image 110-13-308-41-001000 Mill-Max Manufacturing Corp.

CONN IC DIP SOCKET 8POS GOLD

1 Minimum: 1 Tube 110 Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
Product Image 08-3518-10 Aries Electronics

CONN IC DIP SOCKET 8POS GOLD

1 Minimum: 1 Bulk 518 Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
Product Image 8432-21B1-RK-TR 3M

CONN SOCKET PLCC 32POS TIN

450 Minimum: 450 Tape & Reel (TR) Alternate Packaging 8400 Active PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C