Search results

  1. 1
  2. 2
  3. 3
  4. ...
  5. 2131
  6. 2132
  7. 2133

Connectors, Interconnects

Sockets for ICs, Transistors

Datasheet Image M-Part Number Manufacturer Description Quantity Est. Market Price Min. Quantity Packaging Series Part Status Type Numberof Positionsor Pins Grid Pitch Mating Contact Finish Mating Contact Finish Thickness Mating Contact Material Mating Mounting Type Features Termination Pitch Post Contact Finish Post Contact Finish Thickness Post Contact Material Post Housing Material Operating Temperature
Product Image 4808-3004-CP 3M

CONN IC DIP SOCKET 8POS TIN

1 Minimum: 1 Tube 4800 Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 35.0µin (0.90µm) Phosphor Bronze Polyester, Glass Filled -25°C ~ 85°C
Product Image 4816-3000-CP 3M

CONN IC DIP SOCKET 16POS TIN

1 Minimum: 1 Tube 4800 Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 35.0µin (0.90µm) Phosphor Bronze Polyester, Glass Filled -25°C ~ 85°C
Product Image SA163000 On Shore Technology Inc.

CONN IC DIP SOCKET 16POS GOLD

1 Minimum: 1 Tube SA Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Thermoplastic, Polyester, Glass Filled -40°C ~ 105°C
Product Image 110-44-314-41-001000 Mill-Max Manufacturing Corp.

CONN IC DIP SOCKET 14POS TIN

1 Minimum: 1 Tube 110 Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
Product Image 110-43-308-41-001000 Mill-Max Manufacturing Corp.

CONN IC DIP SOCKET 8POS GOLD

1 Minimum: 1 Tube 110 Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
Product Image 08-3518-10 Aries Electronics

CONN IC DIP SOCKET 8POS GOLD

1 Minimum: 1 Bulk 518 Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
Product Image AR 14 HZL-TT Assmann WSW Components

CONN IC DIP SOCKET 14POS TIN

1 Minimum: 1 Tube - Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
Product Image A-CCS 044-Z-SM Assmann WSW Components

IC SOCKET PLCC 44POS TIN SMD

1 Minimum: 1 Tube - Active PLCC 44 (4 x 11) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Polyamide (PA9T), Nylon 9T, Glass Filled -40°C ~ 105°C
Product Image AR 16 HZL-TT Assmann WSW Components

CONN IC DIP SOCKET 16POS TIN

1 Minimum: 1 Tube - Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
Product Image A-CCS 032-Z-SM Assmann WSW Components

IC PLCC SOCKET 32POS TIN SMD

1 Minimum: 1 Tube - Active PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Polyamide (PA9T), Nylon 9T, Glass Filled -40°C ~ 105°C