Connectors, Interconnects

Sockets for ICs, Transistors

DatasheetImageM-Part NumberManufacturerDescriptionQuantityEst. Market PriceMin. QuantityPackagingSeriesPart StatusTypeNumberof Positionsor Pins GridPitch MatingContact Finish MatingContact Finish Thickness MatingContact Material MatingMounting TypeFeaturesTerminationPitch PostContact Finish PostContact Finish Thickness PostContact Material PostHousing MaterialOperating Temperature
Product Image A 08-LC-TTAssmann WSW ComponentsCONN IC DIP SOCKET 8POS TIN1 Minimum: 1Tube-ActiveDIP, 0.3" (7.62mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Tin-Phosphor BronzeThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-Phosphor BronzePolybutylene Terephthalate (PBT)-55°C ~ 85°C
Product Image A 14-LC-TTAssmann WSW ComponentsCONN IC DIP SOCKET 14POS TIN1 Minimum: 1Tube-ActiveDIP, 0.3" (7.62mm) Row Spacing14 (2 x 7)0.100" (2.54mm)Tin-Phosphor BronzeThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-Phosphor BronzePolybutylene Terephthalate (PBT)-55°C ~ 85°C
Product Image A 16-LC-TTAssmann WSW ComponentsCONN IC DIP SOCKET 16POS TIN1 Minimum: 1Tube-ActiveDIP, 0.3" (7.62mm) Row Spacing16 (2 x 8)0.100" (2.54mm)Tin-Phosphor BronzeThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-Phosphor BronzePolybutylene Terephthalate (PBT)-55°C ~ 85°C
Product Image A 20-LC-TTAssmann WSW ComponentsCONN IC DIP SOCKET 20POS TIN1 Minimum: 1Tube-ActiveDIP, 0.3" (7.62mm) Row Spacing20 (2 x 10)0.100" (2.54mm)Tin-Phosphor BronzeThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-Phosphor BronzePolybutylene Terephthalate (PBT)-55°C ~ 85°C
Product Image ED281DTOn Shore Technology Inc.CONN IC DIP SOCKET 28POS TIN1 Minimum: 1TubeEDActiveDIP, 0.3" (7.62mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Tin60.0µin (1.52µm)Phosphor BronzeThrough HoleOpen FrameSolder0.100" (2.54mm)Tin60.0µin (1.52µm)Phosphor BronzePolybutylene Terephthalate (PBT), Glass Filled-55°C ~ 110°C
Product Image AR 08 HZL-TTAssmann WSW ComponentsCONN IC DIP SOCKET 8POS TIN1 Minimum: 1Tube-ActiveDIP, 0.3" (7.62mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Tin-Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Beryllium CopperThermoplastic, Polyester-40°C ~ 105°C
Product Image 4808-3004-CP3MCONN IC DIP SOCKET 8POS TIN1 Minimum: 1Tube4800ActiveDIP, 0.3" (7.62mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Tin35.4µin (0.90µm)Phosphor BronzeThrough HoleOpen FrameSolder0.100" (2.54mm)Tin35.0µin (0.90µm)Phosphor BronzePolyester, Glass Filled-25°C ~ 85°C
Product Image 4816-3000-CP3MCONN IC DIP SOCKET 16POS TIN1 Minimum: 1Tube4800ActiveDIP, 0.3" (7.62mm) Row Spacing16 (2 x 8)0.100" (2.54mm)Tin35.4µin (0.90µm)Phosphor BronzeThrough HoleOpen FrameSolder0.100" (2.54mm)Tin35.0µin (0.90µm)Phosphor BronzePolyester, Glass Filled-25°C ~ 85°C
Product Image A-CCS 044-Z-SMAssmann WSW ComponentsIC SOCKET PLCC 44POS TIN SMD1 Minimum: 1Tube-ActivePLCC44 (4 x 11)0.050" (1.27mm)Tin160.0µin (4.06µm)Phosphor BronzeSurface MountClosed FrameSolder0.050" (1.27mm)Tin160.0µin (4.06µm)Phosphor BronzePolyamide (PA9T), Nylon 9T, Glass Filled-40°C ~ 105°C
Product Image SA143000On Shore Technology Inc.CONN IC DIP SOCKET 14POS GOLD1 Minimum: 1TubeSAActiveDIP, 0.3" (7.62mm) Row Spacing14 (2 x 7)0.100" (2.54mm)GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassThermoplastic, Polyester, Glass Filled-40°C ~ 105°C
Product Image SA163000On Shore Technology Inc.CONN IC DIP SOCKET 16POS GOLD1 Minimum: 1TubeSAActiveDIP, 0.3" (7.62mm) Row Spacing16 (2 x 8)0.100" (2.54mm)GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassThermoplastic, Polyester, Glass Filled-40°C ~ 105°C
Product Image 110-43-308-41-001000Mill-Max Manufacturing Corp.CONN IC DIP SOCKET 8POS GOLD1 Minimum: 1Tube110ActiveDIP, 0.3" (7.62mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
Product Image 4828-3004-CP3MCONN IC DIP SOCKET 28POS TIN1 Minimum: 1Tube4800ActiveDIP, 0.3" (7.62mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Tin35.4µin (0.90µm)Phosphor BronzeThrough HoleOpen FrameSolder0.100" (2.54mm)Tin35.0µin (0.90µm)Phosphor BronzePolyester, Glass Filled-25°C ~ 85°C
Product Image AR 14 HZL-TTAssmann WSW ComponentsCONN IC DIP SOCKET 14POS TIN1 Minimum: 1Tube-ActiveDIP, 0.3" (7.62mm) Row Spacing14 (2 x 7)0.100" (2.54mm)Tin-Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Beryllium CopperThermoplastic, Polyester-40°C ~ 105°C
Product Image 110-43-306-41-001000Mill-Max Manufacturing Corp.CONN IC DIP SOCKET 6POS GOLD1 Minimum: 1Tube110ActiveDIP, 0.3" (7.62mm) Row Spacing6 (2 x 3)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
Product Image AR 16 HZL-TTAssmann WSW ComponentsCONN IC DIP SOCKET 16POS TIN1 Minimum: 1Tube-ActiveDIP, 0.3" (7.62mm) Row Spacing16 (2 x 8)0.100" (2.54mm)Tin-Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Beryllium CopperThermoplastic, Polyester-40°C ~ 105°C
Product Image A-CCS-044-Z-TAssmann WSW ComponentsCONN SOCKET PLCC 44POS TIN1 Minimum: 1Tube-ActivePLCC44 (4 x 11)0.050" (1.27mm)Tin160.0µin (4.06µm)Phosphor BronzeThrough HoleClosed FrameSolder0.100" (2.54mm)Tin160.0µin (4.06µm)Phosphor BronzePolybutylene Terephthalate (PBT)-40°C ~ 105°C
Product Image 1050281001Molex, LLCCONN CAM SOCKET 32POS GOLD800 Minimum: 800Tape & Reel (TR) Alternate Packaging105028ActiveCamera Socket32 (4 x 8)0.035" (0.90mm)Gold12.0µin (0.30µm)Copper AlloySurface MountOpen FrameSolder0.035" (0.90mm)Nickel50.0µin (1.27µm)Copper AlloyThermoplastic-
Product Image 1050281001Molex, LLCCONN CAM SOCKET 32POS GOLD1 Minimum: 1Cut Tape (CT) Alternate Packaging105028ActiveCamera Socket32 (4 x 8)0.035" (0.90mm)Gold12.0µin (0.30µm)Copper AlloySurface MountOpen FrameSolder0.035" (0.90mm)Nickel50.0µin (1.27µm)Copper AlloyThermoplastic-
Product Image 1050281001Molex, LLCCONN CAM SOCKET 32POS GOLD-1 Minimum: 1Reel® Alternate Packaging105028ActiveCamera Socket32 (4 x 8)0.035" (0.90mm)Gold12.0µin (0.30µm)Copper AlloySurface MountOpen FrameSolder0.035" (0.90mm)Nickel50.0µin (1.27µm)Copper AlloyThermoplastic-
Product Image 110-13-308-41-001000Mill-Max Manufacturing Corp.CONN IC DIP SOCKET 8POS GOLD1 Minimum: 1Tube110ActiveDIP, 0.3" (7.62mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Gold10.0µin (0.25µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
Product Image 110-44-424-41-001000Mill-Max Manufacturing Corp.CONN IC DIP SOCKET 24POS TIN1 Minimum: 1Tube110ActiveDIP, 0.4" (10.16mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Tin100.0µin (2.54µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
Product Image 8432-21B1-RK-TR3MCONN SOCKET PLCC 32POS TIN450 Minimum: 450Tape & Reel (TR) Alternate Packaging8400ActivePLCC32 (2 x 7, 2 x 9)0.050" (1.27mm)Tin160.0µin (4.06µm)Copper AlloySurface MountClosed FrameSolder0.050" (1.27mm)Tin160.0µin (4.06µm)Copper AlloyPolybutylene Terephthalate (PBT), Glass Filled-40°C ~ 105°C
Product Image 8432-21B1-RK-TR3MCONN SOCKET PLCC 32POS TIN1 Minimum: 1Cut Tape (CT) Alternate Packaging8400ActivePLCC32 (2 x 7, 2 x 9)0.050" (1.27mm)Tin160.0µin (4.06µm)Copper AlloySurface MountClosed FrameSolder0.050" (1.27mm)Tin160.0µin (4.06µm)Copper AlloyPolybutylene Terephthalate (PBT), Glass Filled-40°C ~ 105°C
Product Image 8432-21B1-RK-TR3MCONN SOCKET PLCC 32POS TIN-1 Minimum: 1Reel® Alternate Packaging8400ActivePLCC32 (2 x 7, 2 x 9)0.050" (1.27mm)Tin160.0µin (4.06µm)Copper AlloySurface MountClosed FrameSolder0.050" (1.27mm)Tin160.0µin (4.06µm)Copper AlloyPolybutylene Terephthalate (PBT), Glass Filled-40°C ~ 105°C
Product Image 110-43-314-41-001000Mill-Max Manufacturing Corp.CONN IC DIP SOCKET 14POS GOLD1 Minimum: 1Tube110ActiveDIP, 0.3" (7.62mm) Row Spacing14 (2 x 7)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
Product Image 110-93-314-41-001000Mill-Max Manufacturing Corp.CONN IC DIP SOCKET 14POS GOLD1 Minimum: 1Tube110ActiveDIP, 0.3" (7.62mm) Row Spacing14 (2 x 7)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-Lead200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
Product Image 110-93-316-41-001000Mill-Max Manufacturing Corp.CONN IC DIP SOCKET 16POS GOLD1 Minimum: 1Tube110ActiveDIP, 0.3" (7.62mm) Row Spacing16 (2 x 8)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-Lead200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
Product Image 917-43-103-41-005000Mill-Max Manufacturing Corp.CONN TRANSIST TO-5 3POS GOLD1 Minimum: 1Tube917ActiveTransistor, TO-53 (Round)-Gold30.0µin (0.76µm)Beryllium CopperThrough HoleClosed FrameSolder-Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
Product Image 110-44-328-41-001000Mill-Max Manufacturing Corp.CONN IC DIP SOCKET 28POS TIN1 Minimum: 1Tube110ActiveDIP, 0.3" (7.62mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Tin100.0µin (2.54µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
Product Image A-CCS 068-Z-TAssmann WSW ComponentsCONN SOCKET PLCC 68POS TIN1 Minimum: 1Tube-ActivePLCC68 (4 x 17)0.050" (1.27mm)Tin160.0µin (4.06µm)Phosphor BronzeThrough HoleClosed FrameSolder0.100" (2.54mm)Tin160.0µin (4.06µm)Phosphor BronzePolybutylene Terephthalate (PBT)-40°C ~ 105°C
Product Image 110-43-316-41-001000Mill-Max Manufacturing Corp.CONN IC DIP SOCKET 16POS GOLD1 Minimum: 1Tube110ActiveDIP, 0.3" (7.62mm) Row Spacing16 (2 x 8)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
Product Image 8444-21B1-RK-TR3MCONN SOCKET PLCC 44POS TIN360 Minimum: 360Tape & Reel (TR) Alternate Packaging8400ActivePLCC44 (4 x 11)0.050" (1.27mm)Tin160.0µin (4.06µm)Copper AlloySurface MountClosed FrameSolder0.050" (1.27mm)Tin160.0µin (4.06µm)Copper AlloyPolybutylene Terephthalate (PBT), Glass Filled-40°C ~ 105°C
Product Image 8444-21B1-RK-TR3MCONN SOCKET PLCC 44POS TIN1 Minimum: 1Cut Tape (CT) Alternate Packaging8400ActivePLCC44 (4 x 11)0.050" (1.27mm)Tin160.0µin (4.06µm)Copper AlloySurface MountClosed FrameSolder0.050" (1.27mm)Tin160.0µin (4.06µm)Copper AlloyPolybutylene Terephthalate (PBT), Glass Filled-40°C ~ 105°C
Product Image 8444-21B1-RK-TR3MCONN SOCKET PLCC 44POS TIN-1 Minimum: 1Reel® Alternate Packaging8400ActivePLCC44 (4 x 11)0.050" (1.27mm)Tin160.0µin (4.06µm)Copper AlloySurface MountClosed FrameSolder0.050" (1.27mm)Tin160.0µin (4.06µm)Copper AlloyPolybutylene Terephthalate (PBT), Glass Filled-40°C ~ 105°C
Product Image AR 28 HZL-TTAssmann WSW ComponentsCONN IC DIP SOCKET 28POS TIN1 Minimum: 1Tube-ActiveDIP, 0.6" (15.24mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Tin-Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Beryllium CopperThermoplastic, Polyester-40°C ~ 105°C
Product Image 210-43-316-41-001000Mill-Max Manufacturing Corp.CONN IC DIP SOCKET 16POS GOLD1 Minimum: 1Tube210ActiveDIP, 0.3" (7.62mm) Row Spacing16 (2 x 8)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
Product Image 110-44-632-41-001000Mill-Max Manufacturing Corp.CONN IC DIP SOCKET 32POS TIN1 Minimum: 1Tube110ActiveDIP, 0.6" (15.24mm) Row Spacing32 (2 x 16)0.100" (2.54mm)Tin100.0µin (2.54µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
Product Image 110-43-318-41-001000Mill-Max Manufacturing Corp.CONN IC DIP SOCKET 18POS GOLD1 Minimum: 1Tube110ActiveDIP, 0.3" (7.62mm) Row Spacing18 (2 x 9)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
Product Image 08-3518-00Aries ElectronicsCONN IC DIP SOCKET 8POS GOLD1 Minimum: 1Bulk518ActiveDIP, 0.3" (7.62mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperSurface MountOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
Product Image 940-44-044-17-400000Mill-Max Manufacturing Corp.CONN SOCKET PLCC 44POS TIN1 Minimum: 1Tube940ActivePLCC44 (4 x 11)0.050" (1.27mm)Tin150.0µin (3.81µm)Beryllium CopperSurface MountClosed FrameSolder0.050" (1.27mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
Product Image 110-43-320-41-001000Mill-Max Manufacturing Corp.CONN IC DIP SOCKET 20POS GOLD1 Minimum: 1Tube110ActiveDIP, 0.3" (7.62mm) Row Spacing20 (2 x 10)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
Product Image 940-44-044-24-000000Mill-Max Manufacturing Corp.CONN SOCKET PLCC 44POS TIN1 Minimum: 1Tube940ActivePLCC44 (4 x 11)0.100" (2.54mm)Tin150.0µin (3.81µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
Product Image 8444-21B1-RK-TP3MCONN SOCKET PLCC 44POS TIN1 Minimum: 1Tube8400ActivePLCC44 (4 x 11)0.050" (1.27mm)Tin160.0µin (4.06µm)Copper AlloySurface MountClosed FrameSolder0.050" (1.27mm)Tin160.0µin (4.06µm)Copper AlloyPolybutylene Terephthalate (PBT), Glass Filled-40°C ~ 105°C
Product Image 110-13-314-41-001000Mill-Max Manufacturing Corp.CONN IC DIP SOCKET 14POS GOLD1 Minimum: 1Tube110ActiveDIP, 0.3" (7.62mm) Row Spacing14 (2 x 7)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Gold10.0µin (0.25µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
Product Image 540-44-032-17-400000Mill-Max Manufacturing Corp.CONN SOCKET PLCC 32POS TIN1 Minimum: 1Tube540ActivePLCC32 (2 x 7, 2 x 9)0.050" (1.27mm)Tin150.0µin (3.81µm)Copper AlloySurface MountClosed FrameSolder0.050" (1.27mm)Tin150.0µin (3.81µm)Copper AlloyPolyphenylene Sulfide (PPS)-55°C ~ 125°C
Product Image 110-44-640-41-001000Mill-Max Manufacturing Corp.CONN IC DIP SOCKET 40POS TIN1 Minimum: 1Tube110ActiveDIP, 0.6" (15.24mm) Row Spacing40 (2 x 20)0.100" (2.54mm)Tin100.0µin (2.54µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
Product Image 940-44-052-24-000000Mill-Max Manufacturing Corp.CONN SOCKET PLCC 52POS TIN1 Minimum: 1Tube940ActivePLCC52 (4 x 13)0.100" (2.54mm)Tin150.0µin (3.81µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
Product Image 110-13-316-41-001000Mill-Max Manufacturing Corp.CONN IC DIP SOCKET 16POS GOLD1 Minimum: 1Tube110ActiveDIP, 0.3" (7.62mm) Row Spacing16 (2 x 8)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Gold10.0µin (0.25µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
Product Image 940-44-068-24-000000Mill-Max Manufacturing Corp.CONN SOCKET PLCC 68POS TIN1 Minimum: 1Tube940ActivePLCC68 (4 x 17)0.100" (2.54mm)Tin150.0µin (3.81µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C