Integrated Circuits (ICs)

Clock/Timing - Clock Buffers, Drivers

DatasheetImageM-Part NumberManufacturerDescriptionQuantityEst. Market PriceMin. QuantityPackagingSeriesPart StatusTypeNumberof CircuitsRatio Input:OutputDifferential Input:OutputInputOutputFrequency MaxVoltage SupplyOperating TemperatureMounting TypePackage CaseSupplier Device Package
Product Image PI6CV304LEXDiodes IncorporatedIC CLK BUFFER 1:4 160MHZ 8TSSOP2 500 Minimum: 2 500Tape & Reel (TR) Alternate Packaging-ActiveFanout Buffer (Distribution)11:4No/NoCMOS, TTLLVCMOS160MHz3 V ~ 3.6 V-40°C ~ 85°CSurface Mount8-TSSOP (0.173", 4.40mm Width)8-TSSOP
Product Image PI6CV304LEXDiodes IncorporatedIC CLK BUFFER 1:4 160MHZ 8TSSOP1 Minimum: 1Cut Tape (CT) Alternate Packaging-ActiveFanout Buffer (Distribution)11:4No/NoCMOS, TTLLVCMOS160MHz3 V ~ 3.6 V-40°C ~ 85°CSurface Mount8-TSSOP (0.173", 4.40mm Width)8-TSSOP
Product Image PI6CV304LEXDiodes IncorporatedIC CLK BUFFER 1:4 160MHZ 8TSSOP-1 Minimum: 1Reel® Alternate Packaging-ActiveFanout Buffer (Distribution)11:4No/NoCMOS, TTLLVCMOS160MHz3 V ~ 3.6 V-40°C ~ 85°CSurface Mount8-TSSOP (0.173", 4.40mm Width)8-TSSOP
Product Image CDC3RL02YFPRTexas InstrumentsIC CLK BUFFER 1:2 52MHZ 8DSBGA3 000 Minimum: 3 000Tape & Reel (TR) Alternate Packaging-ActiveFanout Buffer (Distribution)11:2No/NoLVCMOSLVCMOS52MHz2.3 V ~ 5.5 V-40°C ~ 85°CSurface Mount8-XFBGA, DSBGA8-DSBGA (1.6x0.8)
Product Image CDC3RL02YFPRTexas InstrumentsIC CLK BUFFER 1:2 52MHZ 8DSBGA1 Minimum: 1Cut Tape (CT) Alternate Packaging-ActiveFanout Buffer (Distribution)11:2No/NoLVCMOSLVCMOS52MHz2.3 V ~ 5.5 V-40°C ~ 85°CSurface Mount8-XFBGA, DSBGA8-DSBGA (1.6x0.8)
Product Image CDC3RL02YFPRTexas InstrumentsIC CLK BUFFER 1:2 52MHZ 8DSBGA-1 Minimum: 1Reel® Alternate Packaging-ActiveFanout Buffer (Distribution)11:2No/NoLVCMOSLVCMOS52MHz2.3 V ~ 5.5 V-40°C ~ 85°CSurface Mount8-XFBGA, DSBGA8-DSBGA (1.6x0.8)
Product Image 551MLFTIDT, Integrated Device Technology IncIC CLK BUFFER 1:4 160MHZ 8SOIC3 000 Minimum: 3 000Tape & Reel (TR) Alternate PackagingClockBlocks™ActiveFanout Buffer (Distribution)11:4No/NoCMOSCMOS160MHz3 V ~ 5.5 V0°C ~ 70°CSurface Mount8-SOIC (0.154", 3.90mm Width)8-SOIC
Product Image 551MLFTIDT, Integrated Device Technology IncIC CLK BUFFER 1:4 160MHZ 8SOIC1 Minimum: 1Cut Tape (CT) Alternate PackagingClockBlocks™ActiveFanout Buffer (Distribution)11:4No/NoCMOSCMOS160MHz3 V ~ 5.5 V0°C ~ 70°CSurface Mount8-SOIC (0.154", 3.90mm Width)8-SOIC
Product Image 551MLFTIDT, Integrated Device Technology IncIC CLK BUFFER 1:4 160MHZ 8SOIC-1 Minimum: 1Reel® Alternate PackagingClockBlocks™ActiveFanout Buffer (Distribution)11:4No/NoCMOSCMOS160MHz3 V ~ 5.5 V0°C ~ 70°CSurface Mount8-SOIC (0.154", 3.90mm Width)8-SOIC
Product Image NB3L553DR2GON SemiconductorIC CLK BUFFER 1:4 200MHZ 8SOIC2 500 Minimum: 2 500Tape & Reel (TR) Alternate Packaging-ActiveFanout Buffer (Distribution)11:4No/NoLVCMOS, LVTTLLVCMOS, LVTTL200MHz2.375 V ~ 5.25 V-40°C ~ 85°CSurface Mount8-SOIC (0.154", 3.90mm Width)8-SOIC
Product Image NB3L553DR2GON SemiconductorIC CLK BUFFER 1:4 200MHZ 8SOIC1 Minimum: 1Cut Tape (CT) Alternate Packaging-ActiveFanout Buffer (Distribution)11:4No/NoLVCMOS, LVTTLLVCMOS, LVTTL200MHz2.375 V ~ 5.25 V-40°C ~ 85°CSurface Mount8-SOIC (0.154", 3.90mm Width)8-SOIC
Product Image NB3L553DR2GON SemiconductorIC CLK BUFFER 1:4 200MHZ 8SOIC-1 Minimum: 1Reel® Alternate Packaging-ActiveFanout Buffer (Distribution)11:4No/NoLVCMOS, LVTTLLVCMOS, LVTTL200MHz2.375 V ~ 5.25 V-40°C ~ 85°CSurface Mount8-SOIC (0.154", 3.90mm Width)8-SOIC
Product Image NB3N551MNR4GON SemiconductorIC CLK BUFFER 1:4 180MHZ 8DFN1 000 Minimum: 1 000Tape & Reel (TR) Alternate Packaging-ActiveFanout Buffer (Distribution)11:4No/NoLVCMOS, LVTTLLVCMOS, LVTTL180MHz3 V ~ 5.5 V-40°C ~ 85°CSurface Mount8-VFDFN Exposed Pad8-DFN (2x2)
Product Image NB3N551MNR4GON SemiconductorIC CLK BUFFER 1:4 180MHZ 8DFN1 Minimum: 1Cut Tape (CT) Alternate Packaging-ActiveFanout Buffer (Distribution)11:4No/NoLVCMOS, LVTTLLVCMOS, LVTTL180MHz3 V ~ 5.5 V-40°C ~ 85°CSurface Mount8-VFDFN Exposed Pad8-DFN (2x2)
Product Image NB3N551MNR4GON SemiconductorIC CLK BUFFER 1:4 180MHZ 8DFN-1 Minimum: 1Reel® Alternate Packaging-ActiveFanout Buffer (Distribution)11:4No/NoLVCMOS, LVTTLLVCMOS, LVTTL180MHz3 V ~ 5.5 V-40°C ~ 85°CSurface Mount8-VFDFN Exposed Pad8-DFN (2x2)
Product Image 5PB1102CMGI8IDT, Integrated Device Technology IncIC CLOCK BUFFER 1:2 8DFN4 000 Minimum: 4 000Tape & Reel (TR) Alternate Packaging-ActiveFanout Buffer (Distribution)11:2No/NoLVCMOSLVCMOS200MHz1.71 V ~ 3.465 V-40°C ~ 85°CSurface Mount8-UFDFN8-DFN (2x2)
Product Image 5PB1102CMGI8IDT, Integrated Device Technology IncIC CLOCK BUFFER 1:2 8DFN1 Minimum: 1Cut Tape (CT) Alternate Packaging-ActiveFanout Buffer (Distribution)11:2No/NoLVCMOSLVCMOS200MHz1.71 V ~ 3.465 V-40°C ~ 85°CSurface Mount8-UFDFN8-DFN (2x2)
Product Image 5PB1102CMGI8IDT, Integrated Device Technology IncIC CLOCK BUFFER 1:2 8DFN-1 Minimum: 1Reel® Alternate Packaging-ActiveFanout Buffer (Distribution)11:2No/NoLVCMOSLVCMOS200MHz1.71 V ~ 3.465 V-40°C ~ 85°CSurface Mount8-UFDFN8-DFN (2x2)
Product Image 551MILFTIDT, Integrated Device Technology IncIC CLK BUFFER 1:4 160MHZ 8SOIC3 000 Minimum: 3 000Tape & Reel (TR) Alternate PackagingClockBlocks™ActiveFanout Buffer (Distribution)11:4No/NoCMOSCMOS160MHz3 V ~ 5.5 V-40°C ~ 85°CSurface Mount8-SOIC (0.154", 3.90mm Width)8-SOIC
Product Image 551MILFTIDT, Integrated Device Technology IncIC CLK BUFFER 1:4 160MHZ 8SOIC1 Minimum: 1Cut Tape (CT) Alternate PackagingClockBlocks™ActiveFanout Buffer (Distribution)11:4No/NoCMOSCMOS160MHz3 V ~ 5.5 V-40°C ~ 85°CSurface Mount8-SOIC (0.154", 3.90mm Width)8-SOIC
Product Image 551MILFTIDT, Integrated Device Technology IncIC CLK BUFFER 1:4 160MHZ 8SOIC-1 Minimum: 1Reel® Alternate PackagingClockBlocks™ActiveFanout Buffer (Distribution)11:4No/NoCMOSCMOS160MHz3 V ~ 5.5 V-40°C ~ 85°CSurface Mount8-SOIC (0.154", 3.90mm Width)8-SOIC
Product Image CDCLVC1102PWRTexas InstrumentsIC CLK BUFFER 1:2 250MHZ 8TSSOP2 000 Minimum: 2 000Tape & Reel (TR) Alternate Packaging-ActiveFanout Buffer (Distribution)11:2No/NoLVCMOSLVCMOS250MHz2.3 V ~ 3.6 V-40°C ~ 85°CSurface Mount8-TSSOP (0.173", 4.40mm Width)8-TSSOP
Product Image CDCLVC1102PWRTexas InstrumentsIC CLK BUFFER 1:2 250MHZ 8TSSOP1 Minimum: 1Cut Tape (CT) Alternate Packaging-ActiveFanout Buffer (Distribution)11:2No/NoLVCMOSLVCMOS250MHz2.3 V ~ 3.6 V-40°C ~ 85°CSurface Mount8-TSSOP (0.173", 4.40mm Width)8-TSSOP
Product Image CDCLVC1102PWRTexas InstrumentsIC CLK BUFFER 1:2 250MHZ 8TSSOP-1 Minimum: 1Reel® Alternate Packaging-ActiveFanout Buffer (Distribution)11:2No/NoLVCMOSLVCMOS250MHz2.3 V ~ 3.6 V-40°C ~ 85°CSurface Mount8-TSSOP (0.173", 4.40mm Width)8-TSSOP
Product Image CDCLVC1103PWRTexas InstrumentsIC CLK BUFFER 1:3 250MHZ 8TSSOP2 000 Minimum: 2 000Tape & Reel (TR) Alternate Packaging-ActiveFanout Buffer (Distribution)11:3No/NoLVCMOSLVCMOS250MHz2.3 V ~ 3.6 V-40°C ~ 85°CSurface Mount8-TSSOP (0.173", 4.40mm Width)8-TSSOP
Product Image CDCLVC1103PWRTexas InstrumentsIC CLK BUFFER 1:3 250MHZ 8TSSOP1 Minimum: 1Cut Tape (CT) Alternate Packaging-ActiveFanout Buffer (Distribution)11:3No/NoLVCMOSLVCMOS250MHz2.3 V ~ 3.6 V-40°C ~ 85°CSurface Mount8-TSSOP (0.173", 4.40mm Width)8-TSSOP
Product Image CDCLVC1103PWRTexas InstrumentsIC CLK BUFFER 1:3 250MHZ 8TSSOP-1 Minimum: 1Reel® Alternate Packaging-ActiveFanout Buffer (Distribution)11:3No/NoLVCMOSLVCMOS250MHz2.3 V ~ 3.6 V-40°C ~ 85°CSurface Mount8-TSSOP (0.173", 4.40mm Width)8-TSSOP
Product Image NB3L553MNR4GON SemiconductorIC CLK BUFFER 1:4 200MHZ 8DFN1 000 Minimum: 1 000Tape & Reel (TR) Alternate Packaging-ActiveFanout Buffer (Distribution)11:4No/NoLVCMOS, LVTTLLVCMOS, LVTTL200MHz2.375 V ~ 5.25 V-40°C ~ 85°CSurface Mount8-VFDFN Exposed Pad8-DFN (2x2)
Product Image NB3L553MNR4GON SemiconductorIC CLK BUFFER 1:4 200MHZ 8DFN1 Minimum: 1Cut Tape (CT) Alternate Packaging-ActiveFanout Buffer (Distribution)11:4No/NoLVCMOS, LVTTLLVCMOS, LVTTL200MHz2.375 V ~ 5.25 V-40°C ~ 85°CSurface Mount8-VFDFN Exposed Pad8-DFN (2x2)
Product Image NB3L553MNR4GON SemiconductorIC CLK BUFFER 1:4 200MHZ 8DFN-1 Minimum: 1Reel® Alternate Packaging-ActiveFanout Buffer (Distribution)11:4No/NoLVCMOS, LVTTLLVCMOS, LVTTL200MHz2.375 V ~ 5.25 V-40°C ~ 85°CSurface Mount8-VFDFN Exposed Pad8-DFN (2x2)
Product Image CDCLVC1104PWRTexas InstrumentsIC CLK BUFFER 1:4 250MHZ 8TSSOP2 000 Minimum: 2 000Tape & Reel (TR) Alternate Packaging-ActiveFanout Buffer (Distribution)11:4No/NoLVCMOSLVCMOS250MHz2.3 V ~ 3.6 V-40°C ~ 85°CSurface Mount8-TSSOP (0.173", 4.40mm Width)8-TSSOP
Product Image CDCLVC1104PWRTexas InstrumentsIC CLK BUFFER 1:4 250MHZ 8TSSOP1 Minimum: 1Cut Tape (CT) Alternate Packaging-ActiveFanout Buffer (Distribution)11:4No/NoLVCMOSLVCMOS250MHz2.3 V ~ 3.6 V-40°C ~ 85°CSurface Mount8-TSSOP (0.173", 4.40mm Width)8-TSSOP
Product Image CDCLVC1104PWRTexas InstrumentsIC CLK BUFFER 1:4 250MHZ 8TSSOP-1 Minimum: 1Reel® Alternate Packaging-ActiveFanout Buffer (Distribution)11:4No/NoLVCMOSLVCMOS250MHz2.3 V ~ 3.6 V-40°C ~ 85°CSurface Mount8-TSSOP (0.173", 4.40mm Width)8-TSSOP
Product Image CDCV304PWRTexas InstrumentsIC CLK BUFFER 1:4 200MHZ 8TSSOP2 000 Minimum: 2 000Tape & Reel (TR) Alternate Packaging-ActiveFanout Buffer (Distribution)11:4No/NoLVTTLLVTTL200MHz2.3 V ~ 3.6 V-40°C ~ 85°CSurface Mount8-TSSOP (0.173", 4.40mm Width)8-TSSOP
Product Image CDCV304PWRTexas InstrumentsIC CLK BUFFER 1:4 200MHZ 8TSSOP1 Minimum: 1Cut Tape (CT) Alternate Packaging-ActiveFanout Buffer (Distribution)11:4No/NoLVTTLLVTTL200MHz2.3 V ~ 3.6 V-40°C ~ 85°CSurface Mount8-TSSOP (0.173", 4.40mm Width)8-TSSOP
Product Image CDCV304PWRTexas InstrumentsIC CLK BUFFER 1:4 200MHZ 8TSSOP-1 Minimum: 1Reel® Alternate Packaging-ActiveFanout Buffer (Distribution)11:4No/NoLVTTLLVTTL200MHz2.3 V ~ 3.6 V-40°C ~ 85°CSurface Mount8-TSSOP (0.173", 4.40mm Width)8-TSSOP
Product Image CDCV304PWRG4Texas InstrumentsIC CLK BUFFER 1:4 200MHZ 8TSSOP2 000 Minimum: 2 000Tape & Reel (TR) Alternate Packaging-ActiveFanout Buffer (Distribution)11:4No/NoLVTTLLVTTL200MHz2.3 V ~ 3.6 V-40°C ~ 85°CSurface Mount8-TSSOP (0.173", 4.40mm Width)8-TSSOP
Product Image CDCV304PWRG4Texas InstrumentsIC CLK BUFFER 1:4 200MHZ 8TSSOP1 Minimum: 1Cut Tape (CT) Alternate Packaging-ActiveFanout Buffer (Distribution)11:4No/NoLVTTLLVTTL200MHz2.3 V ~ 3.6 V-40°C ~ 85°CSurface Mount8-TSSOP (0.173", 4.40mm Width)8-TSSOP
Product Image CDCV304PWRG4Texas InstrumentsIC CLK BUFFER 1:4 200MHZ 8TSSOP-1 Minimum: 1Reel® Alternate Packaging-ActiveFanout Buffer (Distribution)11:4No/NoLVTTLLVTTL200MHz2.3 V ~ 3.6 V-40°C ~ 85°CSurface Mount8-TSSOP (0.173", 4.40mm Width)8-TSSOP
Product Image SI53307-B-GMRSilicon LabsIC CLK BUFFER 2:4 725MHZ 16QFN1 000 Minimum: 1 000Tape & Reel (TR) Alternate Packaging-ActiveFanout Buffer (Distribution), Multiplexer12:4Yes/YesCML, HCSL, LVCMOS, LVDS, LVPECLCML, HCSL, LVCMOS, LVDS, LVPECL725MHz1.71 V ~ 3.63 V-40°C ~ 85°CSurface Mount16-VFQFN Exposed Pad16-QFN (3x3)
Product Image SI53307-B-GMRSilicon LabsIC CLK BUFFER 2:4 725MHZ 16QFN1 Minimum: 1Cut Tape (CT) Alternate Packaging-ActiveFanout Buffer (Distribution), Multiplexer12:4Yes/YesCML, HCSL, LVCMOS, LVDS, LVPECLCML, HCSL, LVCMOS, LVDS, LVPECL725MHz1.71 V ~ 3.63 V-40°C ~ 85°CSurface Mount16-VFQFN Exposed Pad16-QFN (3x3)
Product Image SI53307-B-GMRSilicon LabsIC CLK BUFFER 2:4 725MHZ 16QFN-1 Minimum: 1Reel® Alternate Packaging-ActiveFanout Buffer (Distribution), Multiplexer12:4Yes/YesCML, HCSL, LVCMOS, LVDS, LVPECLCML, HCSL, LVCMOS, LVDS, LVPECL725MHz1.71 V ~ 3.63 V-40°C ~ 85°CSurface Mount16-VFQFN Exposed Pad16-QFN (3x3)
Product Image 553MILFTIDT, Integrated Device Technology IncIC CLK BUFFER 1:4 200MHZ 8SOIC3 000 Minimum: 3 000Tape & Reel (TR) Alternate PackagingClockBlocks™ActiveFanout Buffer (Distribution)11:4No/NoCMOSCMOS200MHz2.375 V ~ 5.25 V-40°C ~ 85°CSurface Mount8-SOIC (0.154", 3.90mm Width)8-SOIC
Product Image 553MILFTIDT, Integrated Device Technology IncIC CLK BUFFER 1:4 200MHZ 8SOIC1 Minimum: 1Cut Tape (CT) Alternate PackagingClockBlocks™ActiveFanout Buffer (Distribution)11:4No/NoCMOSCMOS200MHz2.375 V ~ 5.25 V-40°C ~ 85°CSurface Mount8-SOIC (0.154", 3.90mm Width)8-SOIC
Product Image 553MILFTIDT, Integrated Device Technology IncIC CLK BUFFER 1:4 200MHZ 8SOIC-1 Minimum: 1Reel® Alternate PackagingClockBlocks™ActiveFanout Buffer (Distribution)11:4No/NoCMOSCMOS200MHz2.375 V ~ 5.25 V-40°C ~ 85°CSurface Mount8-SOIC (0.154", 3.90mm Width)8-SOIC
Product Image 621NILFTIDT, Integrated Device Technology IncIC CLK BUFFER 1:4 200MHZ 8VFQFPN3 000 Minimum: 3 000Tape & Reel (TR) Alternate Packaging-ActiveFanout Buffer (Distribution)11:4No/NoClockLVCMOS200MHz1.14 V ~ 1.89 V-40°C ~ 85°CSurface Mount8-VFDFN Exposed Pad8-VFQFPN (2x2)
Product Image 621NILFTIDT, Integrated Device Technology IncIC CLK BUFFER 1:4 200MHZ 8VFQFPN1 Minimum: 1Cut Tape (CT) Alternate Packaging-ActiveFanout Buffer (Distribution)11:4No/NoClockLVCMOS200MHz1.14 V ~ 1.89 V-40°C ~ 85°CSurface Mount8-VFDFN Exposed Pad8-VFQFPN (2x2)
Product Image 621NILFTIDT, Integrated Device Technology IncIC CLK BUFFER 1:4 200MHZ 8VFQFPN-1 Minimum: 1Reel® Alternate Packaging-ActiveFanout Buffer (Distribution)11:4No/NoClockLVCMOS200MHz1.14 V ~ 1.89 V-40°C ~ 85°CSurface Mount8-VFDFN Exposed Pad8-VFQFPN (2x2)
Product Image SI53307-B-GMSilicon LabsIC CLK BUFFER 2:4 725MHZ 16QFN1 Minimum: 1Tube Alternate Packaging-ActiveFanout Buffer (Distribution), Multiplexer12:4Yes/YesCML, HCSL, LVCMOS, LVDS, LVPECLCML, HCSL, LVCMOS, LVDS, LVPECL725MHz1.71 V ~ 3.63 V-40°C ~ 85°CSurface Mount16-VFQFN Exposed Pad16-QFN (3x3)
Product Image SI5330F-B00214-GMSilicon LabsIC CLK BUFFER 1:8 CMOS 24QFN1 Minimum: 1Tray Alternate Packaging-ActiveFanout Buffer (Distribution), Translator11:8No/NoCMOS, HSTL, LVTTL, SSTLCMOS200MHz1.71 V ~ 3.63 V-40°C ~ 85°CSurface Mount24-VFQFN Exposed Pad24-QFN (4x4)